European Semiconductor Manufacturing Company (ESMC) is a joint venture between four technology leaders, TSMC, Bosch, Infineon and NXP, to establish a state-of-the-art semiconductor fab in the heart of Europe. ESMC represents our shared commitment to strengthening the European semiconductor ecosystem.
To help us build the foundation of our future fab in Dresden, we are looking for a highly motivated and passionate:
ESMC Trilingual Ops Engineers
Roles and responsibilities for Engineering Field Related Positions:
1. Equipment Engineer (EE):
In this role, you will plan and execute analysis or defect detection projects. You can also learn how to improve and enhance the efficiency of equipment by communicating with cross-functional engineers or vendors.
2. Process Integration Engineer (PIE):
In this role, you will develop and sustain process technologies for eNVM and logic products. You will also have opportunities to work with a team that may include device, integration, yield, lithography, etch, and thin films, or external suppliers to drive leading-edge integrated module development, control, and improvements.
3. Process Engineer (PE):
In this role, you will work with a team that may include device, integration, yield, module, manufacturing, and external suppliers to drive leading-edge integrated module development, control, and improvements. You will also learn to improve process stability/manufacturability for yield and reliability qualification.
4. Intelligent Manufacturing Engineer (MFG):
In this role, you will be responsible for the development and maintenance of these intelligent manufacturing systems, which are widely used for scheduling and dispatching, employee productivity, equipment productivity, process and equipment control, quality defense, and robotic control. By optimizing quality, productivity, efficiency, and flexibility, you will play a crucial role in driving the success of our manufacturing operations.

Job Responsibilities

1. Equipment Engineer (EE):
(1) Handle Nano Diffusion, Thin Film, or Etching equipment. (2) Improve and enhance the efficiency of equipment. (3) Plan and execute the analysis or defect detection projects. (4) Communicate with cross function engineers or vendors.
2. Process Integration Engineer (PIE):
(1) To be responsible for helping to drive leading edge process/device development and optimization of Flash/CMOS/RF devices in order to meet scaling, performance, reliability, and manufacturability requirements. (2) Identify and solve IC process and device problems.
3. Process Engineer (PE):
(1) To develop and sustain process technologies for flash memory and logic products. (2) Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. (3) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.
4. Intelligent Manufacturing Engineer (MFG):
(1) Smart manufacturing engineers will learn leading artificial intelligence manufacturing technologies worldwide. (2) Big data analysis, improving production efficiency: Through data analysis, identify bottleneck machines and improve machine production efficiency. Breakthrough analysis and dispatching project system, optimize production resources and maximize manufacturing efficiency. (3) Machine learning, creating unlimited possibilities: Utilize cutting-edge machine learning technology to improve the production process and create innovative applications that achieve optimal scheduling and maximize wafer production capacity.

Job Qualifications

Qualifications and Education:
1. Equipment Engineer (EE):
(1) Bachelor's degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering-related fields. (2) Have basic mechanical-related knowledge. (3) Good problem-solving skills, communication ability, team spirit, active learning attitude. (4) Hands-on participation and a strong sense of ownership.
2. Process Integration Engineer (PIE):
(1) Bachelor's degree or above in an engineering and scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Physics, Chemistry. (2) Exhibit good and open communication skills; be able to work within cross-functional teams, including internal and external partners. (3) Hands-on participation and a strong sense of ownership.
3. Process Engineer (PE):
(1) Bachelor's degree or above in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or a related engineering discipline. (2) Exhibit good and open communication skills; be able to work within cross-functional teams. (3) Strong technical problem-solving and analytical skills. (4) Hands-on participation and a strong sense of ownership.
4. Intelligent Manufacturing Engineer (MFG):
(1) Bachelor's degree or above in Industrial Engineering, Manufacturing, Production Engineering, Industrial Management, Information Systems, Mechanical and Automation Engineering, Civil Engineering, Applied Mathematics and Statistics, or a related field. (2) Must be an enthusiastic and dedicated individual with the capability to motivate and lead using a team approach. (3) Knowledge of semiconductor processes is a plus.

Language Skills:
Fluent in three languages (English, German, Mandarin Chinese)

Professional Skills:
Communication style: concise, data driven manner

Personal Attributes:
1. Self-starter, highly organized, result driven, able to work independently and operate under pressure and handle tight deadlines. 2. Displays strong intercultural awareness and interpersonal, and facilitation skills 3. Passion for technology and for leading and developing teams. 4. Flexibility to work in a dynamic start-up environment.
Location: Dresden, Germany.
Please apply with English resume.
Each journey starts with a first step.
Joining ESMC at this early stage will provide you with the unique opportunity to actively shape the future of the fab in Dresden, boost your career and put your true potential to the test. You will be working in a fast paced, international startup environment whilst at the same time having access to the experience, talent, and resources of the largest and most advanced semiconductor manufacturer in the world, TSMC. You have ample opportunities to learn about TSMC Operations, Digital Transformation, and various advanced Facilities related topics, both in Taiwan and other sites around the world.
Behind the world’s most advanced technology are real people with real passion. Our success is fueled by our core values: Integrity, Commitment, Innovation and Customer Trust (ICIC).
At ESMC we believe in the power of inclusive leadership and passion. We demonstrate this in our commitment to our people vision: create an inclusive environment to inspire passion and enable the best in YOU.
It is the policy of ESMC to provide equal employment opportunity (EEO) to all persons regardless of age, color, ethnic and national origin, citizenship status, physical or mental disability, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, genetic information, marital status, status with regard to public assistance, veteran status, or any other characteristic protected by federal, state or local law.